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1. 
Cover image for Three-dimensional integrated circuit design
Three-dimensional integrated circuit design
Author 
Pavlidis, Vasilis F., 1976- author. Savidis, Ioannis, author. Frian, Eby G., author.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780124105010
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2. 
Cover image for Handbook of 3D Integration : 3D process technology
Handbook of 3D Integration : 3D process technology
Author 
Garrou, Philip E., editor. Koyanagi, Mitsumasa, editor. Ramm, Peter, editor.
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ONLINE(342210.1)
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527670109
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3. 
Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
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4. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
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ONLINE
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