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Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/1-84628-235-7
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Cover image for Advanced interconnects for ULSI technology
Advanced interconnects for ULSI technology
Author 
Baklanov, Mikhail. Ho, P. S. Zschech, Ehrenfried.
Preferred Shelf Number 
ONLINE
Electronic Access 
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
Electronic version available via EBL
Cover image http://catalogimages.wiley.com/images/db/jimages/9780470662540.jpg
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