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1. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0463-7
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2. 
Cover image for Lead-free solder process development
Lead-free solder process development
Author 
Bath, Jasbir. Henshall, Gregory Arthur. Handwerker, Carol A.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5732782
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3. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-79394-8
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4. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38892-2
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5. 
Cover image for Avoiding inelastic strains in solder joint interconnections of IC devices
Avoiding inelastic strains in solder joint interconnections of IC devices
Author 
Suhir, Ephraim, author.
Preferred Shelf Number 
TK7874.53 .S84 2021 EB
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780429460470
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Cover image for Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Author 
Zhang, Qingke. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-48823-2
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7. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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8. 
Cover image for Solder Joint Reliability Assessment Finite Element Simulation Methodology
Solder Joint Reliability Assessment Finite Element Simulation Methodology
Author 
Tamin, Mohd N. author. Shaffiar, Norhashimah M. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-00092-3
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9. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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10. 
Cover image for Handbook of lead-free solder technology for microelectronic assemblies
Handbook of lead-free solder technology for microelectronic assemblies
Author 
Puttlitz, Karl J. Stalter, Kathleen A.
Preferred Shelf Number 
TK7870.15 .H3657 2004
Electronic Access 
Click here to view.
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11. 
Cover image for Metal Micro-Droplet Based 3D Printing Technology
Metal Micro-Droplet Based 3D Printing Technology
Author 
Qi, Lehua. author. Luo, Jun. author. Shen, He. author. Lian, Hongcheng. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0965-0
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12. 
Cover image for Proceedings of the 7th International Corrosion Prevention Symposium for Research Scholars CORSYM 2021, November 2021
Proceedings of the 7th International Corrosion Prevention Symposium for Research Scholars CORSYM 2021, November 2021
Author 
Jalar, Azman. editor. Embong, Zaidi. editor. Othman, Norinsan Kamil. editor. Yaakob, Najmiddin. editor. Bakar, Maria Abu. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-1851-3
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