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1. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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2. 
Cover image for From bioimaging to biosensors noble metal nanoparticles in biodetection
From bioimaging to biosensors noble metal nanoparticles in biodetection
Author 
Lai-Kwan, Chau. Chang, Huan-Tsung.
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3. 
Cover image for Advances in nanodevices and nanofabrication selected publications from Symposium of Nanodevices and Nanofabrication in ICMAT2011
Advances in nanodevices and nanofabrication selected publications from Symposium of Nanodevices and Nanofabrication in ICMAT2011
Author 
Zhang, Qing, 1961- Milne, W. I. (William I.) Zou, Jianping.
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