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1. 
Cover image for Electrical and electronics materials
Electrical and electronics materials
Author 
Kothari, D. P. (Dwarkadas Pralhaddas), 1944- author. Jain, Mahima, author. Jagwani, Shefali, author.
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TK453 K68 2016
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2. 
Cover image for Ceramic materials for electronics
Ceramic materials for electronics
Author 
Buchanan, Relva C., 1936-, ed.
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TK7871.15.C4 C47 2004
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3. 
Cover image for Supramolecular materials for opto-electronics
Supramolecular materials for opto-electronics
Author 
Koch, Norbert, 1971 June 20-
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ONLINE(343228.1)
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Royal Society of Chemistry http://dx.doi.org/10.1039/9781782626947
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4. 
Cover image for Flexible Electronics Materials and Applications
Flexible Electronics Materials and Applications
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Salleo, Alberto. editor. Wong, William S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-74363-9
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5. 
Cover image for Molecular Electronics Materials, Devices and Applications
Molecular Electronics Materials, Devices and Applications
Author 
Jalabert, Antoine. author. Amara, Amara. author. Clermidy, Fabien. author. SpringerLink (Online service)
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6. 
Cover image for Organic electronics materials, manufacturing and applications
Organic electronics materials, manufacturing and applications
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Klauk, Hagen. John Wiley & Sons.
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http://www3.interscience.wiley.com/cgi-bin/bookhome/112729011
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7. 
Cover image for Microwave electronics measurement and materials characterisation
Microwave electronics measurement and materials characterisation
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Chen, Linfeng.
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8. 
Cover image for Transparent oxide electronics from materials to devices
Transparent oxide electronics from materials to devices
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Barquinha, Pedro. Wiley InterScience (Online service)
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9. 
Cover image for Lead-free solders materials reliability for electronics
Lead-free solders materials reliability for electronics
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Subramaniam, K. N., Ph. D. Wiley InterScience (Online service)
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10. 
Cover image for Organic electronics. II more materials and applications
Organic electronics. II more materials and applications
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Klauk, Hagen.
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11. 
Cover image for Organic electronics materials, processing, devices and applications
Organic electronics materials, processing, devices and applications
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So, Franky.
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12. 
Cover image for HeteroSiC & WASMPE 2011 selected, peer reviewed papers from the 4th Workshop on Advanced Semiconductor Materials and Devices for Power Electronics Applications (HeteroSiC & WASMPE 2011), June 27-30, 2011, Tours, France
HeteroSiC & WASMPE 2011 selected, peer reviewed papers from the 4th Workshop on Advanced Semiconductor Materials and Devices for Power Electronics Applications (HeteroSiC & WASMPE 2011), June 27-30, 2011, Tours, France
Author 
Alquier, Daniel.
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13. 
Cover image for Advanced electrical and electronics materials : processes and applications
Advanced electrical and electronics materials : processes and applications
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Gupta, K. M. Gupta, Nishu.
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14. 
Cover image for Polymers for Electricity and Electronics Materials, Properties, and Applications.
Polymers for Electricity and Electronics Materials, Properties, and Applications.
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Drobny, Jiri George.
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15. 
Cover image for Supramolecular soft matter applications in materials and organic electronics
Supramolecular soft matter applications in materials and organic electronics
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Nakanishi, Takashi.
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16. 
Cover image for Handbook of thiophene-based materials applications in organic electronics and photonics
Handbook of thiophene-based materials applications in organic electronics and photonics
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Perepichka, Igor F. Perepichka, Dmitrii F.
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17. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
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Subramanian, K. N. author. SpringerLink (Online service)
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18. 
Cover image for Applied materials science applications of engineering materials in structural, electronics, thermal, and other industries
Applied materials science applications of engineering materials in structural, electronics, thermal, and other industries
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Chung, Deborah D. L.
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19. 
Cover image for Intelligent Robotics and Applications 16th International Conference, ICIRA 2023, Hangzhou, China, July 5-7, 2023, Proceedings, Part IV
Intelligent Robotics and Applications 16th International Conference, ICIRA 2023, Hangzhou, China, July 5-7, 2023, Proceedings, Part IV
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Yang, Huayong. editor. Liu, Honghai. editor. Zou, Jun. editor. Yin, Zhouping. editor. Liu, Lianqing. editor. (orcid)
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XX(521246.1)
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20. 
Cover image for Biopolymer composites in electronics
Biopolymer composites in electronics
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Sadasivuni, Kishor Kumar.
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21. 
Cover image for Electronic waste : toxicology and public health issues
Electronic waste : toxicology and public health issues
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Fowler, Bruce A., author.
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22. 
Cover image for Novel advances in microsystems technologies and their applications
Novel advances in microsystems technologies and their applications
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Francis, Laurent A., editor. Iniewski, Krzysztof, 1960- editor.
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23. 
Cover image for Signal processing for cognitive radios
Signal processing for cognitive radios
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Jayaweera, Sudharman K., 1972-
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24. 
Cover image for Circuit design techniques for non-crystalline semiconductors
Circuit design techniques for non-crystalline semiconductors
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Sambandan, Sanjiv.
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25. 
Cover image for Advanced Thermal Management Materials
Advanced Thermal Management Materials
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Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)
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26. 
Cover image for Microelectronics to nanoelectronics materials, devices & manufacturability
Microelectronics to nanoelectronics materials, devices & manufacturability
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Kaul, Anupama B.
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Cover image for Multifunctional molecular materials
Multifunctional molecular materials
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Ouahab, Lahcn̈e.
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28. 
Cover image for Electric machines modeling, condition monitoring, and fault diagnosis
Electric machines modeling, condition monitoring, and fault diagnosis
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Toliyat, Hamid A.
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29. 
Cover image for Stretchable electronics
Stretchable electronics
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Someya, Takao, 1968-
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30. 
Cover image for 100 years of superconductivity
100 years of superconductivity
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Rogalla, H. (Horst) Kes, P. H. (Peter H.)
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31. 
Cover image for Hermeticity of electronic packages
Hermeticity of electronic packages
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Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.
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32. 
Cover image for Graphene synthesis and applications
Graphene synthesis and applications
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Choi, Wonbong, 1963- Lee, Jo-won, 1952-
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33. 
Cover image for Next-generation batteries and fuel cells for commercial, military, and space applications
Next-generation batteries and fuel cells for commercial, military, and space applications
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Jha, A. R.
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Cover image for Computational methods for large systems electronic structure approaches for biotechnology and nanotechnology
Computational methods for large systems electronic structure approaches for biotechnology and nanotechnology
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Reimers, Jeffrey R. Wiley InterScience (Online service)
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35. 
Cover image for New materials III transparent conducting and semiconducting oxides, solid state lighting, novel superconductors and electromagnetic metamaterials : proceedings of the 5th Forum on New Materials, part of CIMTEC 2010--12th International Ceramics Congress and 5th Forum on New Materials, Montecatini Terme, Italy, June 13-18, 2010
New materials III transparent conducting and semiconducting oxides, solid state lighting, novel superconductors and electromagnetic metamaterials : proceedings of the 5th Forum on New Materials, part of CIMTEC 2010--12th International Ceramics Congress and 5th Forum on New Materials, Montecatini Terme, Italy, June 13-18, 2010
Author 
Forum on New Materials (5th : 2010 : Montecatini Terme, Italy) Vincenzini, P., 1939- Ginley, D. S. (David S.) International Meeting on Modern Ceramics Technologies (12th : 2010 : Montecatini Terme, Italy)
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Cover image for Nanoelectronics nanowires, molecular electronics, and nanodevices
Nanoelectronics nanowires, molecular electronics, and nanodevices
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Iniewski, Krzysztof.
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Cover image for Introduction to surface engineering and functionally engineered materials
Introduction to surface engineering and functionally engineered materials
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Martin, Peter M. Wiley InterScience (Online service)
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38. 
Cover image for Electronic properties of materials
Electronic properties of materials
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Hummel, Rolf E.
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QC176 H86 2011
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39. 
Cover image for Thin-film organic photonics molecular layer deposition and applications
Thin-film organic photonics molecular layer deposition and applications
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Yoshimura, Tetsuzo.
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40. 
Cover image for Adhesives technology for electronic applications materials, processing, reliability
Adhesives technology for electronic applications materials, processing, reliability
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Licari, James J., 1930- Swanson, Dale W.
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41. 
Cover image for Source : music of the avant-garde, 1966-1973
Source : music of the avant-garde, 1966-1973
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Austin, Larry. Kahn, Douglas, 1951- Gurusinghe, Nilendra.
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Cover image for Carbons for electrochemical energy storage and conversion systems
Carbons for electrochemical energy storage and conversion systems
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Bǧuin, Franȯis, 1945- Fr?ckowiak, El?bieta.
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Cover image for CdTe and related compounds physics, defects, hetero- and nanostructures, crystal growth surfaces and applications
CdTe and related compounds physics, defects, hetero- and nanostructures, crystal growth surfaces and applications
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Triboulet, R. Siffert, P. (Paul)
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Cover image for Surfaces and interfaces of electronic materials
Surfaces and interfaces of electronic materials
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Brillson, L. J.
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Cover image for Metamaterials critique and alternatives
Metamaterials critique and alternatives
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Munk, Ben (Benedikt A.)
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Cover image for Solid-state physics for electronics
Solid-state physics for electronics
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Moliton, André. Wiley InterScience (Online service)
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Cover image for CdTe and related compounds physics, defects, technology, hetero- and nanostructures and applications : physics, CdTe-based nanostructures, and semimagnetic semiconductors, defects
CdTe and related compounds physics, defects, technology, hetero- and nanostructures and applications : physics, CdTe-based nanostructures, and semimagnetic semiconductors, defects
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Triboulet, R. Siffert, P. (Paul)
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Cover image for CVD diamond for electronic devices and sensors
CVD diamond for electronic devices and sensors
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Sussmann, Ricardo S.
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Cover image for Electrical characterization of organic electronic materials and devices
Electrical characterization of organic electronic materials and devices
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Stallinga, Peter, 1966- Wiley InterScience (Online service)
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50. 
Cover image for Piezoelectricity Evolution and Future of a Technology
Piezoelectricity Evolution and Future of a Technology
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Heywang, Walter. author. Lubitz, Karl. author. Wersing, Wolfram. author. SpringerLink (Online service)
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Cover image for Functional Nanostructures Processing, Characterization, and Applications
Functional Nanostructures Processing, Characterization, and Applications
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Seal, Sudipta. editor. SpringerLink (Online service)
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52. 
Cover image for Liquid phase epitaxy of electronic, optical, and optoelectronic materials
Liquid phase epitaxy of electronic, optical, and optoelectronic materials
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Capper, Peter. Mauk, Michael. Wiley InterScience (Online service)
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53. 
Cover image for Carbon nanotubes properties and applications
Carbon nanotubes properties and applications
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O'Connell, Michael (Michael J.)
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54. 
Cover image for Electronic materials science
Electronic materials science
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Irene, Eugene A.
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55. 
Cover image for Electronic materials science
Electronic materials science
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Irene, Eugene A. John Wiley & Sons.
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56. 
Cover image for Ferroelectric Thin Films Basic Properties and Device Physics for Memory Applications
Ferroelectric Thin Films Basic Properties and Device Physics for Memory Applications
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Okuyama, Masanori. editor. Ishibashi, Yoshihiro. editor. SpringerLink (Online service)
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57. 
Cover image for Electronic Composites Modeling, Characterization, Processing, and MEMS Applications
Electronic Composites Modeling, Characterization, Processing, and MEMS Applications
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Taya, Minoru.
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58. 
Cover image for Adhesives technology for electronic applications materials, processes, reliability
Adhesives technology for electronic applications materials, processes, reliability
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Licari, James J., 1930- Swanson, Dale W.
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Cover image for Organic electroluminescence
Organic electroluminescence
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Kafafi, Zakya H.
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60. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
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Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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Electronic materials science
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Irene, Eugene A.
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Cover image for Advances in photonic materials and devices proceedings of the 106th Annual Meeting of the American Ceramic Society : Indianapolis, Indiana, USA (2004)
Advances in photonic materials and devices proceedings of the 106th Annual Meeting of the American Ceramic Society : Indianapolis, Indiana, USA (2004)
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Bhandarkar, Suhas. American Ceramic Society. Meeting (106th : 2004 : Indianapolis, Ind.) Wiley InterScience (Online service) Symposium on Photonics Materials and Devices (2004 : Indianapolis, Ind.)
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Cover image for Developments in dielectric materials and electronic devices proceedings of the 106th Annual Meeting of the American Ceramic Society : Indianapolis, Indiana, USA (2004)
Developments in dielectric materials and electronic devices proceedings of the 106th Annual Meeting of the American Ceramic Society : Indianapolis, Indiana, USA (2004)
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American Ceramic Society. Meeting (106th : 2004 : Indianapolis, Ind.) Nair, K. M.
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Cover image for Coating materials for electronic applications polymers, processes, reliability, testing
Coating materials for electronic applications polymers, processes, reliability, testing
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Licari, James J., 1930-
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Handbook of superconducting materials
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Cardwell, David A. Ginley, D. S. (David S.)
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Handbook of high-temperature superconductor electronics
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Khare, Neeraj.
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Electronic properties of materials
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Hummel, Rolf E.
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Resistor theory and technology
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Zandman, Felix, 1928- Simon, Paul-Rene, ort. yaz. Szwarc, Joseph, ort. yaz.
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Cover image for Semiconducting polymers chemistry, physics, and engineering
Semiconducting polymers chemistry, physics, and engineering
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Hadziioannou, Georges. Hutten, Paul F. van.
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Hermeticity of electronic packages
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Greenhouse, Hal.
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Electric refractory materials
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Kumashiro, Yukinobu, 1939-
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Cover image for Electronic materials the oligomer approach
Electronic materials the oligomer approach
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Müllen, K. (Klaus) Wegner, Gerhard, 1940-
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Cover image for Ion beam modification of materials proceedings of the ninth International Conference on Ion Beam Modification of Materials, Canberra, Australia, 5-10 February, 1995
Ion beam modification of materials proceedings of the ninth International Conference on Ion Beam Modification of Materials, Canberra, Australia, 5-10 February, 1995
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International Conference on Ion Beam Modification of Materials (9th : 1995 : Canberra, A.C.T.) Williams, James S. (James Stanislaus), 1948- Elliman, R. G. (Rob G.) Ridgway, M. C. (Mark C.)
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Surface properties of electronic materials
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King, D. A. (David Anthony), 1939- Woodruff, D. P.
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Cover image for Silicides for VLSI applications
Silicides for VLSI applications
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Murarka, S. P.
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