Search Results for Microelectronic.

1.

Microelectronic packaging

Author

Datta, Madhav. ?saka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)

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2.

Microelectronic circuits

Author

Sedra, Adel S., author. Smith, Kenneth C. (Kenneth Carless), author.

Preferred Shelf Number

TK7867 S43 2016

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3.

Microelectronic devies

Author

Yang, Edward S.

Preferred Shelf Number

TK 7874 Y36 1988

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4.

Microelectronic circuit design

Author

Jaeger, Richard C. Blalock, Travis N.

Preferred Shelf Number

TK7874 J33 2016

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5.

Microelectronic circuit design

Author

Jaeger, Richard C. Blalock, Travis N.

Preferred Shelf Number

TK7874 J33 2011

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6.

Microelectronic circuit design

Author

Jaeger, Richard C. Blalock, Travis N.

Preferred Shelf Number

TK7874 J33 2010

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7.

Microelectronic circuit design

Author

Jaeger, Richard C. Blalock, Travis N., ort. yaz.

Preferred Shelf Number

TK 7874 J333 2004

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8.

Microelectronic systems for technicians

Author

Pereira, Oswyn.

Preferred Shelf Number

TK 7874 P414 1984

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9.

Introduction to microelectronic fabrication

Author

Jaeger, Richard C.

Preferred Shelf Number

TK7874 J33 2002

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10.

Microelectronic Test Structures for CMOS Technology

Author

Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)

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ONLINE

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http://dx.doi.org/10.1007/978-1-4419-9377-9

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11.

Microelectronic Systems Circuits, Systems and Applications

Author

Heuberger, Albert. editor. Elst, Günter. editor. Hanke, Randolf. editor. SpringerLink (Online service)

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ONLINE

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http://dx.doi.org/10.1007/978-3-642-23071-4

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12.

Defects in microelectronic materials and devices

Author

Fleetwood, Daniel. Pantelides, Sokrates T. Schrimpf, Ronald Donald.

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13.

Microelectronic applications of chemical mechanical planarization

Author

Li, Yuzhuo. Wiley InterScience (Online service)

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ONLINE

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Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0742/2007015557-b.html
John Wiley http://dx.doi.org/10.1002/9780470180907

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14.

Force Sensors for Microelectronic Packaging Applications

Author

Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)

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ONLINE

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http://dx.doi.org/10.1007/b138345

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15.

Chemical mechanical planarization of microelectronic materials

Author

Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)

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ONLINE

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John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html

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16.

Electron-beam technology in microelectronic fabrication

Author

Brewer, George Raymond, 1922- Ballantyne, J. P.

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ONLINE

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ScienceDirect http://www.sciencedirect.com/science/book/9780121335502

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17.

Plasma electronics : applications in microelectronic device fabrication

Author

Makabe, T. (Toshiaki), author. Petrovi¿̐ưc, Z., author.

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ONLINE(356943.1)

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18.

Plasma electronics applications in microelectronic device fabrication

Author

Makabe, T. (Toshiaki) Petrovi?, Z.

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19.

Modeling of film deposition for microelectronic applications

Author

Rossnagel, Stephen M.

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ONLINE

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ScienceDirect http://www.sciencedirect.com/science/book/9780125330220

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20.

Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing

Author

Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)

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ONLINE

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Wiley InterScience An electronic book accessible through the World Wide Web; click for information

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21.

Handbook of lead-free solder technology for microelectronic assemblies

Author

Puttlitz, Karl J. Stalter, Kathleen A.

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22.

Polymeric materials for microelectronic applications : science and technology

Author

Ito, Hiroshi, ed. Tagawa, Seichi, ed. Horie, Kazuyuki, 1941- Kåobunshi Gakkai (Japan). Polymers for Microelectronics and Photonics Group. American Chemical Society. Division of Polymeric Materials: Science and Engineering.

Preferred Shelf Number

TK 7871.15.P6 P59 1994

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23.

Microelectronic processing : an introduction to the manufacture of integrated circuits

Author

Ruska, W. Scot.

Preferred Shelf Number

TK 7874 R87 1987

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24.

Heat transfer in microelectronic equipment : a practical guide

Author

Seely, John H.

Preferred Shelf Number

TK 7874 S4 1972

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25.

Enhanced phase-locked loop structures for power and energy applications

Author

Karimi-Ghartemani, Masoud, author.

Preferred Shelf Number

ONLINE(341794.1)

Electronic Access

Ebook Library http://public.eblib.com/choice/publicfullrecord.aspx?p=1658815
ebrary http://site.ebrary.com/id/10853333
John Wiley http://dx.doi.org/10.1002/9781118795187

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26.

CMOS circuit design, layout, and simulation

Author

Baker, R. Jacob, 1964- Wiley InterScience (Online service)

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ONLINE

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Wiley InterScience An electronic book accessible through the World Wide Web; click for information

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27.

Advanced electronic packaging

Author

Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-

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ONLINE

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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522

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28.

Nanometer frequency synthesis beyond the phase-locked loop

Author

Xiu, Liming.

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ONLINE

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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6266786

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29.

Reliability wearout mechanisms in advanced CMOS technologies

Author

Strong, Alvin Wayne, 1946-

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ONLINE

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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5361029

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30.

Nonvolatile memory technologies with emphasis on Flash a comprehensive guide to understanding and using NVM devices

Author

Brewer, Joe (Joe E.) Gill, Manzur.

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ONLINE

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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5201541

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31.

High-performance system design circuits and logic

Author

Oklobdzija, Vojin G. IEEE Circuits and Systems Society. IEEE Solid-State Circuits Society.

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ONLINE

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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5265197

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32.

Low-voltage/low-power integrated circuits and systems low-voltage mixed-signal ciruits

Author

Sánchez-Sinencio, Edgar. Andreou, Andreas G. IEEE Solid-State Circuits Society.

Preferred Shelf Number

ONLINE

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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5264057

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33.

Electronic and photonic circuits and devices

Author

Waynant, Ronald W. Lowell, John. IEEE Circuits and Systems Society. Components, Packaging & Manufacturing Technology Society.

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ONLINE

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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263558

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34.

Nonvolatile semiconductor memory technology a comprehensive guide to understanding and to using NVSM devices

Author

Brown, William D., 1943- Brewer, Joe (Joe E.)

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ONLINE

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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263122

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35.

Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability

Author

Suganuma, Katsuaki, editor.

Preferred Shelf Number

ONLINE

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ScienceDirect https://www.sciencedirect.com/science/book/9780081020944

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36.

Mikroelektroniğin temelleri

Author

Razavi, Behzad Özerdem, Mehmet Siraç, çeviri editörü Kaya, İbrahim.

Preferred Shelf Number

TK7874 R3919 2018

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37.

Adhesion in microelectronics

Author

Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.

Preferred Shelf Number

ONLINE(341844.1)

Electronic Access

ebrary An electronic book accessible through the World Wide Web; click to view
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917
John Wiley http://dx.doi.org/10.1002/9781118831373

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38.

MEMS fundamental technology and applications

Author

Choudhary, Vikas. Iniewski, Krzysztof.

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39.

Semiconductor packaging materials interaction and reliability

Author

Chen, Andrea. Lo, Randy.

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40.

Corrosion mechanisms in theory and practice

Author

Marcus, P. (Philippe), 1953-

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41.

Fundamentals and applications of ultrasonic waves

Author

Cheeke, J. David N.

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42.

3D IC stacking technology

Author

Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.

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43.

Introduction to microsystem packaging technology

Author

Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-

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44.

Quantum-well laser array packaging nanoscale packaging techniques

Author

Tomm, Jens W. Jim�enez, J. (Juan)

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45.

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

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46.

Advanced electronic packaging

Author

Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-

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ONLINE

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47.

IC component sockets

Author

Liu, Weifeng. Pecht, Michael. John Wiley & Sons.

Preferred Shelf Number

ONLINE

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John Wiley http://dx.doi.org/10.1002/0471648272
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html

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