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Cover image for Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Author 
Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28522-6
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2. 
Cover image for Electronics Process Technology Production Modelling, Simulation and Optimisation
Electronics Process Technology Production Modelling, Simulation and Optimisation
Author 
Sauer, Wilfried. author. Oppermann, Martin. author. Werner, Sebastian. author. Wohlrabe, Heinz. author. Zerna, Thomas. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-354-X
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Online Library~1
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