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1. 
Cover image for Microelectronic packaging
Microelectronic packaging
Author 
Datta, Madhav. Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)
Preferred Shelf Number 
TK7870.15 .M53 2005
Electronic Access 
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2. 
Cover image for Electrochemical microsystem technologies
Electrochemical microsystem technologies
Author 
Datta, Madhav. Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)
Preferred Shelf Number 
TP255 .E38 2002
Electronic Access 
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3. 
Cover image for Electrodissolution processes : fundamentals and applications
Electrodissolution processes : fundamentals and applications
Author 
Datta, Madhav, author.
Preferred Shelf Number 
TJ1191
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780367808594
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
Cover image for Electrochemical Nanotechnologies
Electrochemical Nanotechnologies
Author 
Osaka, Tetsuya. editor. Datta, Madhav. editor. Shacham-Diamand, Yosi. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-1424-8
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5. 
Cover image for Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Author 
Shacham-Diamand, Yosi. editor. Osaka, Tetsuya. editor. Datta, Madhav. editor. Ohba, Takayuki. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-95868-2
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