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1. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-76534-1
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2. 
Cover image for Chemical mechanical planarization of microelectronic materials
Chemical mechanical planarization of microelectronic materials
Author 
Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html
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