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1. 
Cover image for Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Author 
Joy, Soumitra R.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394290000
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2. 
Cover image for Nano-interconnect materials and models for next generation integrated circuit design
Nano-interconnect materials and models for next generation integrated circuit design
Author 
Bhattacharya, Sandip (Professor of electrical engineering), editor. J., Ajayan, editor. Herrera, Fernando Avila, editor.
Preferred Shelf Number 
TK7874.84
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003331650
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for Interconnect Technologies for Integrated Circuits and Flexible Electronics
Interconnect Technologies for Integrated Circuits and Flexible Electronics
Author 
Agrawal, Yash. editor. (orcid)0000-0001-9736-9581 Mummaneni, Kavicharan. editor. Sathyakam, P. Uma. editor. (orcid)0000-0002-6203-0956 SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-4476-7
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4. 
Cover image for Avoiding inelastic strains in solder joint interconnections of IC devices
Avoiding inelastic strains in solder joint interconnections of IC devices
Author 
Suhir, Ephraim, author.
Preferred Shelf Number 
TK7874.53 .S84 2021 EB
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780429460470
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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5. 
Cover image for Nano Interconnects : Device Physics, Modeling and Simulation.
Nano Interconnects : Device Physics, Modeling and Simulation.
Author 
Khursheed, Afreen, author. Khare, Kavita, author.
Preferred Shelf Number 
TK7874.53
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003104193
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Cover image for Electromagnetic bandgap (EBG) structures : common mode filters for high speed digital systems
Electromagnetic bandgap (EBG) structures : common mode filters for high speed digital systems
Author 
Orlandi, Antonio, 1963- author. Archambeault, Bruce, author. de Paulis, Francesco, 1981- author. Connor, Samuel, author.
Preferred Shelf Number 
QC611.8 .W53
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119281559
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7. 
Cover image for Fundamentals of reliability engineering : applications in multistage interconnection networks
Fundamentals of reliability engineering : applications in multistage interconnection networks
Author 
Gunawan, Indra.
Preferred Shelf Number 
ONLINE(342010.1)
Electronic Access 
Books24x7 http://www.books24x7.com/marc.asp?bookid=63558
Ebook Library http://public.eblib.com/choice/publicfullrecord.aspx?p=1641079
Ebook Library http://www.UTS.eblib.com.AU/EBLWeb/patron/?target=patron&extendedid=P_1641079_0
ebrary http://site.ebrary.com/id/10843879
John Wiley http://dx.doi.org/10.1002/9781118914410
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8. 
Cover image for High-speed photonics interconnects
High-speed photonics interconnects
Author 
Chrostowski, Lukas. Iniewski, Krzysztof.
Preferred Shelf Number 
TK7874.53 .H54 2013
Electronic Access 
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9. 
Cover image for High performance integrated circuit design
High performance integrated circuit design
Author 
Salman, Emre. Friedman, Eby G.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
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10. 
Cover image for Advanced interconnects for ULSI technology
Advanced interconnects for ULSI technology
Author 
Baklanov, Mikhail. Ho, P. S. Zschech, Ehrenfried.
Preferred Shelf Number 
ONLINE
Electronic Access 
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
Electronic version available via EBL
Cover image http://catalogimages.wiley.com/images/db/jimages/9780470662540.jpg
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11. 
Cover image for On-chip communication architectures system on chip interconnect
On-chip communication architectures system on chip interconnect
Author 
Pasricha, Sudeep. Dutt, Nikil.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780123738929
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12. 
Cover image for Ceramic interconnect technology handbook
Ceramic interconnect technology handbook
Author 
Barlow, Fred D. Elshabini, Aicha.
Preferred Shelf Number 
TK7871.15 .C4 C44 2007
Electronic Access 
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