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1. 
Cover image for Microelectronic packaging
Microelectronic packaging
Author 
Datta, Madhav. Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)
Preferred Shelf Number 
TK7870.15 .M53 2005
Electronic Access 
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2. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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3. 
Cover image for Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Author 
Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)
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ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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4. 
Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author 
Suganuma, Katsuaki, editor.
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ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
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5. 
Cover image for Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Author 
Voyiadjis, George Z. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5589-9
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6. 
Cover image for Adhesion in microelectronics
Adhesion in microelectronics
Author 
Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.
Preferred Shelf Number 
ONLINE(341844.1)
Electronic Access 
ebrary An electronic book accessible through the World Wide Web; click to view
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917
John Wiley http://dx.doi.org/10.1002/9781118831373
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7. 
Cover image for Adhesion measurement of films and coatings. Volume 2
Adhesion measurement of films and coatings. Volume 2
Author 
Mittal, Kash L., 1945- editor. Taylor and Francis.
Preferred Shelf Number 
QC183
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8. 
Cover image for MEMS : fundamental technology and applications
MEMS : fundamental technology and applications
Author 
Choudhary, Vikas. Iniewski, Krzysztof.
Preferred Shelf Number 
TK7875 .M457 2013
Electronic Access 
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9. 
Cover image for Semiconductor packaging : materials interaction and reliability
Semiconductor packaging : materials interaction and reliability
Author 
Chen, Andrea., author. Lo, Randy.
Preferred Shelf Number 
TK7870.15 .C54 2012
Electronic Access 
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10. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
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ONLINE
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11. 
Cover image for Quantum-well laser array packaging nanoscale packaging techniques
Quantum-well laser array packaging nanoscale packaging techniques
Author 
Tomm, Jens W. Jim�enez, J. (Juan)
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ONLINE
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12. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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ONLINE
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