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1. 
Cover image for Microelectronic packaging
Microelectronic packaging
Author 
Datta, Madhav. ?saka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)
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2. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138345
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3. 
Cover image for Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Author 
Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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4. 
Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author 
Suganuma, Katsuaki, editor.
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Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
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5. 
Cover image for Adhesion in microelectronics
Adhesion in microelectronics
Author 
Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.
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ONLINE(341844.1)
Electronic Access 
ebrary An electronic book accessible through the World Wide Web; click to view
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917
John Wiley http://dx.doi.org/10.1002/9781118831373
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6. 
Cover image for MEMS fundamental technology and applications
MEMS fundamental technology and applications
Author 
Choudhary, Vikas. Iniewski, Krzysztof.
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7. 
Cover image for Semiconductor packaging materials interaction and reliability
Semiconductor packaging materials interaction and reliability
Author 
Chen, Andrea. Lo, Randy.
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8. 
Cover image for Introduction to microsystem packaging technology
Introduction to microsystem packaging technology
Author 
Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-
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9. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
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10. 
Cover image for Quantum-well laser array packaging nanoscale packaging techniques
Quantum-well laser array packaging nanoscale packaging techniques
Author 
Tomm, Jens W. Jim�enez, J. (Juan)
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11. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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12. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-
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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522
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