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1. 
Cover image for SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
Author 
Li, Suny, 1974- author.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991
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2. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
Format: 
Availability 
Online Library~1
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3. 
Cover image for Routing in the third dimension from VLSI chips to MCMs
Routing in the third dimension from VLSI chips to MCMs
Author 
Sherwani, N. A. (Naveed A.) Bhingarde, Siddharth. Panyam, Anand.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263943
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Availability 
Online Library~1
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