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1. 
Cover image for Parts selection and management
Parts selection and management
Author 
Pecht, Michael.
Preferred Shelf Number 
ONLINE
Electronic Access 
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Full text available from Wiley InterScience
HathiTrust Digital Library, Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/54046845.html
John Wiley http://dx.doi.org/10.1002/0471723886
Book review (E-STREAMS) http://www.e-streams.com/es0804/es0804_4027.html
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2. 
Cover image for Contamination of electronic assemblies
Contamination of electronic assemblies
Author 
Pecht, Michael.
Preferred Shelf Number 
TK7870.15 C66 2003
Format: 
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Beytepe Library~1
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3. 
Cover image for Prognostics and health management of electronics
Prognostics and health management of electronics
Author 
Pecht, Michael.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9780470385845
MyiLibrary, Table of contents http://www.myilibrary.com?id=181459&ref=toc
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4. 
Cover image for China's electronics industry the definitive guide for companies and policy makers with interests in China
China's electronics industry the definitive guide for companies and policy makers with interests in China
Author 
Pecht, Michael.
Preferred Shelf Number 
ONLINE
Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780815515364
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5. 
Cover image for Lead-free electronics
Lead-free electronics
Author 
Ganesan, Sanka. Pecht, Michael.
Preferred Shelf Number 
ONLINE
Electronic Access 
Click for information
John Wiley http://dx.doi.org/10.1002/047000780X
MyiLibrary, Table of contents http://www.myilibrary.com?id=34963&ref=toc
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6. 
Cover image for Reliability engineering
Reliability engineering
Author 
Kapur, Kailash C., 1941- author. Pecht, Michael, author.
Preferred Shelf Number 
ONLINE(341870.1)
Electronic Access 
Ebook Library http://public.eblib.com/choice/publicfullrecord.aspx?p=1658817
John Wiley http://dx.doi.org/10.1002/9781118841716
MyiLibrary http://www.myilibrary.com?id=595055
Image http://images.contentreserve.com/ImageType-100/0128-1/{879AE24E-0D4B-4A31-AF41-37FA562C2FA3}Img100.jpg
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7. 
Cover image for Encapsulation technologies for electronic applications
Encapsulation technologies for electronic applications
Author 
Ardebili, Haleh. Pecht, Michael G.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815515760
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8. 
Cover image for Encapsulation technologies for electronic applications
Encapsulation technologies for electronic applications
Author 
Ardebili, Haleh, author. Zhang, Jiawei, author. Pecht, Michael, author.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780128119785
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9. 
Cover image for IC component sockets
IC component sockets
Author 
Liu, Weifeng. Pecht, Michael. John Wiley & Sons.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/0471648272
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html
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10. 
Cover image for Risk-Based Engineering An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
Risk-Based Engineering An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
Author 
Varde, Prabhakar V. author. Pecht, Michael G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-0090-5
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11. 
Cover image for Copper Wire Bonding
Copper Wire Bonding
Author 
Chauhan, Preeti S. author. Choubey, Anupam. author. Zhong, ZhaoWei. author. Pecht, Michael G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5761-9
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12. 
Cover image for Optimum Cooling of Data Centers Application of Risk Assessment and Mitigation Techniques
Optimum Cooling of Data Centers Application of Risk Assessment and Mitigation Techniques
Author 
Dai, Jun. author. Ohadi, Michael M. author. Das, Diganta. author. Pecht, Michael G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5602-5
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