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1. 
Cover image for Avoiding inelastic strains in solder joint interconnections of IC devices
Avoiding inelastic strains in solder joint interconnections of IC devices
Author 
Suhir, Ephraim, author.
Preferred Shelf Number 
TK7874.53 .S84 2021 EB
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780429460470
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Lead-free soldering process development and reliability
Lead-free soldering process development and reliability
Author 
Bath, Jasbir, editor.
Preferred Shelf Number 
TK7870.15 .L434 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093
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3. 
Cover image for Lead-free solders materials reliability for electronics
Lead-free solders materials reliability for electronics
Author 
Subramaniam, K. N., Ph. D. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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4. 
Cover image for Welding licensing exam study guide
Welding licensing exam study guide
Author 
Miller, Rex, 1929- Miller, Mark R.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
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5. 
Cover image for Lead-free solder process development
Lead-free solder process development
Author 
Bath, Jasbir. Henshall, Gregory Arthur. Handwerker, Carol A.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5732782
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6. 
Cover image for Electrically conductive adhesives
Electrically conductive adhesives
Author 
Gomatam, R. (Rajesh) Mittal, K. L., 1945-
Preferred Shelf Number 
TP968 .E42 2008
Electronic Access 
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7. 
Cover image for Lead-free electronics iNEMI projects lead to successful manufacturing
Lead-free electronics iNEMI projects lead to successful manufacturing
Author 
Bradley, Edwin.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5201530
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8. 
Cover image for Lead-free soldering in electronics : science, technology and environmental impact
Lead-free soldering in electronics : science, technology and environmental impact
Author 
Suganuma, Katsuaki.
Preferred Shelf Number 
TK7870.15 .L43 2004
Electronic Access 
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9. 
Cover image for Handbook of lead-free solder technology for microelectronic assemblies
Handbook of lead-free solder technology for microelectronic assemblies
Author 
Puttlitz, Karl J. Stalter, Kathleen A.
Preferred Shelf Number 
TK7870.15 .H3657 2004
Electronic Access 
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10. 
Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author 
Lee, Ning-Cheng.
Preferred Shelf Number 
ONLINE
Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780750672184
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11. 
Cover image for Soldering in electronics assembly
Soldering in electronics assembly
Author 
Judd, Mike. Brindley, Keith.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780750635455
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