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1. 
Cover image for Regional integration and the global trading system
Regional integration and the global trading system
Author 
Anderson, Kym, ed. Blackhurst, Richard, ed.
Preferred Shelf Number 
HF 1418.5 R44 1993
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2. 
Cover image for Sensory-motor integration in the nervous system
Sensory-motor integration in the nervous system
Author 
Creutzfeldt, O., ed. Schmidt, R. F., ed. Willis, W. D., ed.
Preferred Shelf Number 
WL 102 S474 1984 1.K
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3. 
Cover image for Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017)
Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017)
Author 
Lee, Sukhan. editor. Ko, Hanseok. editor. Oh, Songhwai. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-90509-9
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4. 
Cover image for Gas Turbine Design, Components and System Design Integration
Gas Turbine Design, Components and System Design Integration
Author 
Schobeiri, Meinhard T. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-58378-5
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5. 
Cover image for Network-on-chip : the next generation of system-on-chip integration
Network-on-chip : the next generation of system-on-chip integration
Author 
Kundu, Santanu, author. Chattopadhyay, Santanu, contributor.
Preferred Shelf Number 
ONLINE(357050.1)
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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6. 
Cover image for Wind Power Integration Connection and System Operational Aspects
Wind Power Integration Connection and System Operational Aspects
Author 
Fox, Brendan Bryans, Leslie Flynn, Damian Jenkins, Nick Milborrow, David
Preferred Shelf Number 
\(364920.1)
Electronic Access 
http://dx.doi.org/10.1049/PBRN014E
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7. 
Cover image for System design and control integration for advanced manufacturing
System design and control integration for advanced manufacturing
Author 
Li, Han-Xiong, author. Lu, XinJiang (Manufacturing researcher), author.
Preferred Shelf Number 
ONLINE(341830.1)
Electronic Access 
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1818247
John Wiley http://dx.doi.org/10.1002/9781118822401
http://swb.eblib.com/patron/FullRecord.aspx?p=1818247
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8. 
Cover image for Driving sustainability to business success : the DS factor-management system integration and automation
Driving sustainability to business success : the DS factor-management system integration and automation
Author 
Pilot, Jayne.
Preferred Shelf Number 
ONLINE(342062.1)
Electronic Access 
Ebook Library Click here to view book
Cover image http://catalogimages.wiley.com/images/db/jimages/9781118356937.jpg
John Wiley http://dx.doi.org/10.1002/9781118936733
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9. 
Cover image for VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers
VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers
Author 
Burg, Andreas. editor. Coṣkun, Ayṣe. editor. Guthaus, Matthew. editor. Katkoori, Srinivas. editor. Reis, Ricardo. editor.
Preferred Shelf Number 
ONLINE(335188.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-45073-0
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10. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
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ONLINE
Electronic Access 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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11. 
Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping.
Preferred Shelf Number 
TK7874.893 L53 2012
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12. 
Cover image for Three Dimensional System Integration IC Stacking Process and Design
Three Dimensional System Integration IC Stacking Process and Design
Author 
Papanikolaou, Antonis. editor. Soudris, Dimitrios. editor. Radojcic, Riko. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0962-6
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