Title:
Introduction to microsystem packaging technology
Author:
Jin, Yufeng.
ISBN:
9781439865972
Publication Information:
Boca Raton : Taylor & Francis, 2011.
Physical Description:
xiii, 218 p. : ill. (some col.).
Contents:
ch. 1. Introduction -- ch. 2. Design technique for microsystems packaging and integration -- ch. 3. Substrate technology -- ch. 4. Interconnection technology -- ch. 5. Device-level packaging -- ch. 6. MEMS packaging -- ch. 7. Module assembly and optoelectronic packaging -- ch. 8. System-level packaging technology -- ch. 9. Reliability -- ch. 10. Prospects for microsystems packaging technology.
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