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Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Title:
Advanced Materials for Thermal Management of Electronic Packaging
Author:
Tong, Xingcun Colin. author.
ISBN:
9781441977595
Physical Description:
XXII, 618 p. online resource.
Series:
Springer Series in Advanced Microelectronics, 30
Series Title:
Springer Series in Advanced Microelectronics, 1437-0387 ; 30
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E-Book 172970-2001 ONLINE
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