Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Title:
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author:
Li, Er-Ping.
ISBN:
9781118166727

9780470623466
Publication Information:
[United States] : IEEE Press ; Hoboken : Wiley, c2012.
Physical Description:
1 online resource.
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