Title:
Designing TSVs for 3D Integrated Circuits
Author:
Khan, Nauman. author.
ISBN:
9781461455080
Physical Description:
X, 76 p. 34 illus., 29 illus. in color. online resource.
Series:
SpringerBriefs in Electrical and Computer Engineering,
Added Author:
Added Corporate Author:
Electronic Access:
http://dx.doi.org/10.1007/978-1-4614-5508-0Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 331791-1001 | ONLINE(331791.1) | Searching... | Searching... |