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Cover image for Adhesive bonding in five steps : achieving safe and high quality bonds
Title:
Adhesive bonding in five steps : achieving safe and high quality bonds
Author:
Klingen, Jürgen, author.
ISBN:
9783527832262
Physical Description:
1 online resource.
Contents:
Front Matter -- Introduction -- History of Adhesive-Bonding Technology -- Wetting, Adhesion, and Cohesion -- Adhesive Bonding in Industry and Craft -- The 5 Steps for Achieving Safe and High-Quality Bonds (Overview) -- Planning (Step 1) - Preparing the Plan and the Project Contract -- Concept (Step 2a) - Substrates, their Surfaces, and their Treatment -- Concept (Step 2b) - Adhesives, their Selection, and Definition of Concepts -- Feasibility (Step 3) - Demonstrating Feasibility and Validation of the Preferred Concept -- Development (Step 4) - Establishing a Robust Manufacturing Process Ready for Production -- Start of Production (Step 5) -- Contemporary Adhesive-Bonding applications -- General References -- Index
Abstract:
Adhesive bonding is a low-heat joining technique and capable of joining virtually all technically usable materials together in a two-dimensional manner. The bond created by an adhesive is built up very gently, since the bonding process requires neither high heat - as with welding or soldering - nor structurally weakening holes - as with riveting or screwing. Since the bond is usually applied over a large area, it also ensures a relatively uniform stress distribution in the component. Using a clearly structured 5-step management system, this book provides detailed instructions for the steps required to set up a stable process for producing a safe and high-quality bonded component. The focus is on the treatment of the material surfaces to be bonded, the selection of suitable adhesives, the dimensioning of the bond, and the process steps for metering/mixing and curing the adhesives. The user is thus presented with sustainable materials as well as modern bonding processes. Here, the special focus is on the suitable methods for surface treatment of the substrates, the adhesives to be used and the processing methods to be employed relevant for the manufacture of bonded components in industry and trade.
Local Note:
John Wiley and Sons
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