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Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Title:
Materials for Information Technology Devices, Interconnects and Packaging
Author:
Zschech, Ehrenfried. editor.
ISBN:
9781846282355
Physical Description:
XIX, 508 p. 338 illus. online resource.
Series:
Engineering Materials and Processes,
Series Title:
Engineering Materials and Processes, 1619-0181
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E-Book 175333-2001 ONLINE
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