Title:
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author:
Li, Er-Ping.
ISBN:
9781118166727
9780470623466
Publication Information:
[United States] : IEEE Press ; Hoboken : Wiley, c2012.
Physical Description:
1 online resource.
Subject Term:
Genre:
Added Corporate Author:
Electronic Access:
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551Copies:
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Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 249361-1001 | ONLINE | Searching... | Searching... |