Cover image for VLSI : circuits for emerging applications
Title:
VLSI : circuits for emerging applications
Author:
Wojcicki, Tomasz, editor.
ISBN:
9781315215549

9781351822749

9781466599109
Physical Description:
1 online resource
Series:
Devices, circuits, and systems

Devices, circuits, and systems.
Contents:
chapter 1. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- chapter 2. Arithmetic implemented with semiconductor quantum-dot cellular automata / Earl E. Swartzlander Jr., Heumpil Cho, Inwook Kong, and Seong-Wan Kim -- chapter 3. Novel capacitor-less A2RAM memory cells for beyond 22-nm nodes / Noel Rodrguez and Francisco Gamiz -- chapter 4. Four-state hybrid spintronics-straintronics : extremely low-power information processing with multiferroic nanomagnets possessing biaxial anisotropy / Noel D'Souza, Jayasimha Atulasimha, and Supriyo Bandyopadhyay -- chapter 5. Improvement and applications of large-area flexible electronics with organic transistors / Koichi Ishida, Hiroshi Fuketa, Tsuyoshi Sekitani, Makoto Takamiya, Hiroshi Toshiyoshi, Takao Someya, and Takayasu Sakurai -- chapter 6. Soft-error mitigation approaches for high-performance processor memories / Lawrence T. Clark -- chapter 7. Design space exploration of wavelength-routed optical networks-on-chip topologies for 3D stacked multi- and many-core processors / Luca Ramini and Davide Bertozzi -- chapter 8. Quest for energy efficiency in digital signal processing : architectures, algorithms, and systems / Ramakrishnan Venkatasubramanian -- chapter 9. Nanoelectromechanical relays : an energy efficient alternative in logic design / Ramakrishnan Venkatasubramanian and Poras T. Balsara -- chapter 10. High-performance and customizable bioinformatic and biomedical very-large-scale-integration architectures / Yao Xin, Benben Liu, Ray C.C. Cheung, and Chao Wang -- chapter 11. Basics, applications, and design of reversible circuits / Robert Wille -- chapter 12. Three-dimensional spintronics / Dorothee Petit, Rhodri Mansell, Amalio Fernandez-Pacheco, JiHyun Lee, and Russell P. Cowburn -- chapter 13. Soft-error-aware power optimization using dynamic threshold / Selahattin Sayil -- chapter 14. Future of asynchronous logic / Scott C. Smith and Jia Di -- chapter 15. Memristor-CMOS-hybrid synaptic devices exhibiting spike-timing-dependent plasticity / Tetsuya Asai -- chapter 16. Very-large-scale integration implementations of cryptographic algorithms / Tony Thomas -- chapter 17. Dynamic intrinsic chip ID for hardware security / Toshiaki Kirihata and Sami Rosenblatt -- chapter 18. Ultra-low-power audio communication system for full implantable cochlear implant application / Yannick Vaiarello and Jonathan Laudanski -- chapter 19. Heterogeneous memory design / Chengen Yang, Zihan Xu, Chaitali Chakrabarti, and Yu Cao -- chapter 20. Soft-error resilient circuit design / Chia-Hsiang Chen, Phil Knag, and Zhengya Zhang.
Abstract:
Preface Only recently the world celebrated the 60th anniversary of the invention of the first transistor. The first integrated circuit was built a decade later, with the first microprocessor designed in the early 1970s. Today, integrated circuits are part of almost every aspect of our daily life. They help us to live longer and more comfortably, and to do more, and do it faster. And all that is possible because of the relentless search for new materials, new circuit designs, and new ideas happening on a daily basis at universities and within the industry around the globe. Profiliferation of integrated circuits in our daily lives does not mean making more of the same. It is actually the opposite. It is about making more of something completely different and customized for a particular application. And today's circuit designers cannot complain about the shortage of things to work with. All leading semiconductor foundries are offering now at least six different process nodes, from 180 nm down to 16 nm, with each node having two, three, or even more flavors. There are at least three different IO voltage standards--3.3 V, 2.5 V, and 1.8 volumes And apart from the mainstream CMOS process, each foundry offers more options such as GaAs, SOI, and GaN; new, even more exotic materials are not far behind. It all gives engineers an almost unlimited number of options and choices to make to achieve their objectives or their application-- Provided by publisher.
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E-Book 547446-1001 TK7874.75 .V57155 2014
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