Cover image for Recent Trends in VLSI and Semiconductor Packaging
Title:
Recent Trends in VLSI and Semiconductor Packaging
Author:
Vasudeva Reddy, T., editor.
ISBN:
9781003616399

9781040361580

9781040361641
Edition:
First edition.
Physical Description:
1 online resource (xxxiv, 616 pages).
Subject Term:
Electronic packaging.

COMPUTERS / Programming / Algorithms
Added Author:
Vasudeva Reddy, T.,

Madhava Rao, K.,
Electronic Access:
Taylor & Francis https://www.taylorfrancis.com/books/9781003616399
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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