Cover image for Thermal and structural electronic packaging analysis for space and extreme environments
Title:
Thermal and structural electronic packaging analysis for space and extreme environments
Author:
Cepeda-Rizo, Juan, author.
ISBN:
9781003247005

9781000511079

9781000511086
Edition:
First edition.
Physical Description:
1 online resource.
Series:
Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems
Subject Term:
Electronic packaging.

Electronic apparatus and appliances -- Reliability.

Space vehicles -- Electronic equipment -- Design and construction.

Extreme environments.

TECHNOLOGY / Engineering / Civil

TECHNOLOGY / Engineering / Mechanical
Added Author:
Gayle, Jeremiah,

Ravich, Joshua,
Electronic Access:
Taylor & Francis https://www.taylorfrancis.com/books/9781003247005
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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