Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC

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Title:

Author:

Li, Er-Ping.

ISBN:

9781118166727

9780470623466

Publication Information:

[United States] : IEEE Press ; Hoboken : Wiley, c2012.

Physical Description:

1 online resource.

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Library	Material Type	Item Barcode	Shelf Number	Status	Item Holds
Searching... Online Library	E-Book	249361-1001	ONLINE	Searching... Unknown	Searching... Unavailable