Title:
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author:
Lee, Ning-Cheng.
ISBN:
9780080492247
Publication Information:
Boston : Newnes, c2002.
Physical Description:
1 online resource (ix, 270 p.) : ill.
Electronic Access:
Volltext http://www.sciencedirect.com/science/book/9780750672184Copies:
Available:*
Library  | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 256308-1001 | ONLINE | Searching... | Searching... |