Title:
Through-silicon vias for 3D integration
Author:
Lau, John.
ISBN:
9780071785150
Publication Information:
New York : McGraw Hill Professional, [2012]
Physical Description:
1 electronic text (xxiv, 487 p. : ill. (some col.)) : PDF file.
Series:
McGraw Hill ebook library. Engineering and computing, Electrical and electronics
Series Title:
McGraw Hill ebook library. Engineering and computing, Electrical and electronics
Electronic Access:
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Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 293478-1001 | ONLINE | Searching... | Searching... |