Cover image for 3D IC stacking technology
Title:
3D IC stacking technology
Author:
Wu, Banqiu.
ISBN:
9780071741965
Publication Information:
New York : McGraw Hill Professional, 2011.
Physical Description:
1 electronic text (xviii, 521 p. : ill.) : PDF file.
Series:
McGraw Hill ebook library. Engineering and computing. Electrical and electronic
Series Title:
McGraw Hill ebook library. Engineering and computing. Electrical and electronic
Subject Term:
Three-dimensional integrated circuits.

Three-dimensional integrated circuits -- Design and construction.

Microelectronic packaging.

Semiconductors -- Design and construction.

Electronic apparatus and appliances -- Design and construction.

Multichip modules (Microelectronics)

Three-dimensional integrated circuits -- Computer-aided design.

Three-dimensional integrated circuits -- Testing.

Integrated circuits industry.
Added Author:
Wu, Banqiu.

Kumar, Ajay.

Ramaswami, Sesh.
Electronic Access:
Subscription required
Holds:

Copies:

Library
Click to Sort
Material Type
Click to Sort
Item Barcode
Click to Sort
Shelf Number
Click to Sort
Status
Click to Sort
Item Holds
Click to Sort
Searching...
 E-Book 293493-1001 ONLINE
Searching...