Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Select an Action

Title:

Author:

Cheng, Jie. author.

ISBN:

9789811061653

Edition:

1st ed. 2018.

Physical Description:

XVIII, 137 p. 103 illus. online resource.

Series:

Springer Theses, Recognizing Outstanding Ph.D. Research,

Subject Term:

Added Corporate Author:

Electronic Access:

Holds:
Copies:

Library	Material Type	Item Barcode	Shelf Number	Status	Item Holds
Searching... Online Library	E-Book	401399-1001	ONLINE	Searching... Unknown	Searching... Unavailable