Title:
Chiplet Design and Heterogeneous Integration Packaging
Author:
Lau, John H. author.
ISBN:
9789811999178
Edition:
1st ed. 2023.
Physical Description:
XXII, 525 p. 543 illus., 501 illus. in color. online resource.
Contents:
State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
Added Corporate Author:
Electronic Access:
https://doi.org/10.1007/978-981-19-9917-8Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 527684-1001 | ONLINE | Searching... | Searching... |