Title:
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author:
Salah, Khaled. author.
ISBN:
9783319076119
Edition:
1st ed. 2015.
Physical Description:
IX, 179 p. 159 illus., 99 illus. in color. online resource.
Series:
Analog Circuits and Signal Processing,
Contents:
Introduction: Work around Moore's Law -- 3D/TSV Enabling Technologies -- TSV Modeling and Analysis -- TSV Verification -- TSV Macro-Modeling Framework -- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter -- Imperfection in TSV Modeling -- New Trends in TSV -- TSV Fabrication -- Conclusions.
Added Corporate Author:
Electronic Access:
https://doi.org/10.1007/978-3-319-07611-9Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 529725-1001 | ONLINE | Searching... | Searching... |