Title:
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author:
Lee, Tae-Kyu. author.
ISBN:
9781461492665
Edition:
1st ed. 2015.
Physical Description:
XIII, 253 p. 151 illus., 81 illus. in color. online resource.
Contents:
Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
Added Corporate Author:
Electronic Access:
https://doi.org/10.1007/978-1-4614-9266-5Copies:
Available:*
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|---|---|---|---|---|---|
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