<B>Contents</b> <br>Foreword; B.S. Meyerson <br><b><i>Introduction</i></b> <br>The Big Picture; <i>J.D. Cressler</i> <br>A Brief History of the Field; <i>J.D. Cressler</i> <br><b><i>Fabrication of SiGe HBT BiCMOS Technology</i></b> <br>Overview: Fabrication of SiGe HBT BiCMOS Technology; <i>J.D. Cressler</i> <br>Device Structures and BiCMOS Integration; <i>D.L. Harame</i> <br>SiGe HBTs on CMOS-Compatible SOI; <i>J. Cai and T.H. Ning</i> <br>Passive Components; <i>J.N. Burghartz</i> <br>Industry Examples at State-of-the-Art: IBM; <i>A.J. Joseph and J.S. Dunn</i> <br>Industry Examples at State-of-the-Art: Jazz; <i>P.H.G. Kempf</i> <br>Industry Examples at State-of-the-Art: Hitachi; <i>K. Washio</i> <br>Industry Examples at State-of-the-Art: Infineon; <i>T.F. Meister, H. Schäfer, W. Perndl, and J. Böck</i> <br>Industry Examples at State-of-the-Art: IHP; <i>D. Knoll</i> <br>Industry Examples at State-of-the-Art: ST; <i>A. Chantre, M. Laurens, B. Szelag, H. Baudry, P. Chevalier, J. Mourier, G. Troillard, B. Martinet, M. Marty, and A. Monroy</i> <br>Industry Examples at State-of-the-Art: Texas Instruments; <i>B. El-Kareh, S. Balster, P. Steinmann, and H. Yasuda</i> <br>Industry Examples at State-of-the-Art: Philips; <i>R. Colclaser and P. Deixler</i>