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1681. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-33913-2
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1682. 
Cover image for Computational Intelligence for Engineering and Manufacturing
Computational Intelligence for Engineering and Manufacturing
Author 
Andina, Diego. editor. Pham, Duc Truong. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-37452-3
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1683. 
Cover image for Ultra-Wideband, Short-Pulse Electromagnetics 7
Ultra-Wideband, Short-Pulse Electromagnetics 7
Author 
Sabath, Frank. editor. Mokole, Eric L. editor. Schenk, Uwe. editor. Nitsch, Daniel. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-37731-5
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1684. 
Cover image for Frontiers of Ferroelectricity A Special Issue of the Journal of Materials Science
Frontiers of Ferroelectricity A Special Issue of the Journal of Materials Science
Author 
Lang, Sidney B. author. Chan, Helen L. W. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38039-1
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1685. 
Cover image for Metric- Driven Design Verification An Engineer's and Executive's Guide to First Pass Success
Metric- Driven Design Verification An Engineer's and Executive's Guide to First Pass Success
Author 
Carter, Hamilton B. author. Hemmady, Shankar. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38152-7
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1686. 
Cover image for Power Analysis Attacks Revealing the Secrets of Smart Cards
Power Analysis Attacks Revealing the Secrets of Smart Cards
Author 
Mangard, Stefan. author. Oswald, Elisabeth. author. Popp, Thomas. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38162-6
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1687. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-38892-2
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1688. 
Cover image for Design and Optimization of Passive UHF RFID Systems
Design and Optimization of Passive UHF RFID Systems
Author 
Curty, Jari-Pascal. author. Declercq, Michel. author. Dehollain, Catherine. author. Joehl, Norbert. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-44710-0
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1689. 
Cover image for CMOS Current-Mode Circuits for Data Communications
CMOS Current-Mode Circuits for Data Communications
Author 
Yuan, Fei. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-47691-9
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1690. 
Cover image for Analog Circuit Design Techniques at 0.5 V
Analog Circuit Design Techniques at 0.5 V
Author 
Chatterjee, Shouri. author. Pun, Kong Pang. author. Stanić, Nebojša. author. Tsividis, Yannis. author. Kinget, Peter. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-69954-7
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1691. 
Cover image for Compiling Esterel
Compiling Esterel
Author 
Potop-Butucaru, Dumitru. author. Edwards, Stephen A. author. Berry, Gérard. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
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http://dx.doi.org/10.1007/978-0-387-70628-3
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1692. 
Cover image for Low Power Methodology Manual For System-on-Chip Design
Low Power Methodology Manual For System-on-Chip Design
Author 
Keating, Michael. author. Flynn, David. author. Aitken, Robert. author. Gibbons, Alan. author. Shi, Kaijian. author.
Preferred Shelf Number 
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http://dx.doi.org/10.1007/978-0-387-71819-4
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