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13. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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14. 
Cover image for Machine Learning Support for Fault Diagnosis of System-on-Chip
Machine Learning Support for Fault Diagnosis of System-on-Chip
Author 
Girard, Patrick. editor. Blanton, Shawn. editor. Wang, Li-C. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-19639-3
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15. 
Cover image for Ultra-low Voltage Circuit Techniques for Energy Harvesting
Ultra-low Voltage Circuit Techniques for Energy Harvesting
Author 
Radin, Rafael Luciano. author. Machado, Marcio Bender. author. Sawan, Mohamad. author. Galup-Montoro, Carlos. author. Schneider, Marcio Cherem. author.
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https://doi.org/10.1007/978-3-031-04492-2
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16. 
Cover image for Proceedings of Fourth International Conference on Communication, Computing and Electronics Systems ICCCES 2022
Proceedings of Fourth International Conference on Communication, Computing and Electronics Systems ICCCES 2022
Author 
Bindhu, V. editor. Tavares, João Manuel R. S. editor. Vuppalapati, Chandrasekar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7753-4
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17. 
Cover image for Artificial Intelligence and Hardware Accelerators
Artificial Intelligence and Hardware Accelerators
Author 
Mishra, Ashutosh. editor. Cha, Jaekwang. editor. Park, Hyunbin. editor. Kim, Shiho. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22170-5
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18. 
Cover image for The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022)
The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022)
Author 
Ma, Chengbin. editor. Zhang, Yiming. editor. Li, Siqi. editor. Zhao, Lei. editor. Liu, Ming. editor.
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https://doi.org/10.1007/978-981-99-0631-4
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19. 
Cover image for Springer Handbook of Semiconductor Devices
Springer Handbook of Semiconductor Devices
Author 
Rudan, Massimo. editor. Brunetti, Rossella. editor. Reggiani, Susanna. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-79827-7
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20. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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21. 
Cover image for Applications in Electronics Pervading Industry, Environment and Society APPLEPIES 2022
Applications in Electronics Pervading Industry, Environment and Society APPLEPIES 2022
Author 
Berta, Riccardo. editor. De Gloria, Alessandro. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30333-3
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22. 
Cover image for Embedded Systems Design using the MSP430FR2355 LaunchPad™
Embedded Systems Design using the MSP430FR2355 LaunchPad™
Author 
LaMeres, Brock J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20888-1
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23. 
Cover image for Multi-Gigahertz Nyquist Analog-to-Digital Converters Architecture and Circuit Innovations in Deep-Scaled CMOS and FinFET Technologies
Multi-Gigahertz Nyquist Analog-to-Digital Converters Architecture and Circuit Innovations in Deep-Scaled CMOS and FinFET Technologies
Author 
Ramkaj, Athanasios T. author. Pelgrom, Marcel J.M. author. Steyaert, Michiel S. J. author. Tavernier, Filip. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22709-7
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24. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
Author 
Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7636-0
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