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13. 
Cover image for Carbon Nanotubes for Interconnects Process, Design and Applications
Carbon Nanotubes for Interconnects Process, Design and Applications
Author 
Todri-Sanial, Aida. editor. Dijon, Jean. editor. Maffucci, Antonio. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-29746-0
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14. 
Cover image for Hardware IP Security and Trust
Hardware IP Security and Trust
Author 
Mishra, Prabhat. editor. Bhunia, Swarup. editor. Tehranipoor, Mark. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-49025-0
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15. 
Cover image for Foundations of Hardware IP Protection
Foundations of Hardware IP Protection
Author 
Bossuet, Lilian. editor. Torres, Lionel. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-50380-6
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16. 
Cover image for Fundamentals of IP and SoC Security Design, Verification, and Debug
Fundamentals of IP and SoC Security Design, Verification, and Debug
Author 
Bhunia, Swarup. editor. Ray, Sandip. editor. Sur-Kolay, Susmita. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-50057-7
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17. 
Cover image for Fundamentals of Electronic Systems Design
Fundamentals of Electronic Systems Design
Author 
Lienig, Jens. author. (orcid)0000-0002-2140-4587 Bruemmer, Hans. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-55840-0
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18. 
Cover image for Emerging Technology and Architecture for Big-data Analytics
Emerging Technology and Architecture for Big-data Analytics
Author 
Chattopadhyay, Anupam. editor. (orcid)0000-0002-8818-6983 Chang, Chip Hong. editor. Yu, Hao. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-54840-1
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19. 
Cover image for 3D Stacked Chips From Emerging Processes to Heterogeneous Systems
3D Stacked Chips From Emerging Processes to Heterogeneous Systems
Author 
Elfadel, Ibrahim (Abe) M. editor. (orcid)0000-0003-3220-9987 Fettweis, Gerhard. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-20481-9
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20. 
Cover image for Distributed Simulation A Model Driven Engineering Approach
Distributed Simulation A Model Driven Engineering Approach
Author 
Topçu, Okan. author. Durak, Umut. author. Oğuztüzün, Halit. author. Yilmaz, Levent. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-03050-0
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21. 
Cover image for Elements of Cloud Computing Security A Survey of Key Practicalities
Elements of Cloud Computing Security A Survey of Key Practicalities
Author 
Alani, Mohammed M. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-41411-9
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22. 
Cover image for Service-oriented architecture : a field guide to integrating XML and Web services
Service-oriented architecture : a field guide to integrating XML and Web services
Author 
Erl, Thomas.
Preferred Shelf Number 
QA76.9.A73 E75 2004
Format: 
Availability 
Beytepe Library~1
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23. 
Cover image for Architectures for e-Business systems : building the foundation for tomorrow's success
Architectures for e-Business systems : building the foundation for tomorrow's success
Author 
Purba, Sanjiv.
Preferred Shelf Number 
HF5548.32 .A73 2002
Electronic Access 
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