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13. 
Cover image for Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-28163-1
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14. 
Cover image for Nonsmooth Modeling and Simulation for Switched Circuits
Nonsmooth Modeling and Simulation for Switched Circuits
Author 
Acary, Vincent. author. Bonnefon, Olivier. author. Brogliato, Bernard. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-9681-4
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15. 
Cover image for Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-11598-1
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16. 
Cover image for Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Author 
Radetzki, Martin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9714-0
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17. 
Cover image for Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Author 
Grasser, Tibor. editor. Selberherr, Siegfried. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-211-72861-1
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18. 
Cover image for Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Author 
Kogel, Tim. author. Leupers, Rainer. author. Meyr, Heinrich. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4826-2
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19. 
Cover image for Advances in Design and Specification Languages for SoCs Selected Contributions from FDL’04
Advances in Design and Specification Languages for SoCs Selected Contributions from FDL’04
Author 
Boulet, Pierre. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136935
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20. 
Cover image for Mechatronic Systems Fundamentals
Mechatronic Systems Fundamentals
Author 
Isermann, Rolf. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-259-4
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