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13. 
Cover image for CMOS circuit design, layout, and simulation
CMOS circuit design, layout, and simulation
Author 
Baker, R. Jacob, 1964- Wiley InterScience (Online service)
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ONLINE
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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14. 
Cover image for Grounds for grounding a circuit-to-system handbook
Grounds for grounding a circuit-to-system handbook
Author 
Joffe, Elya B. Lock, Kai-Sang.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5452231
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15. 
Cover image for Microelectronic circuit design
Microelectronic circuit design
Author 
Jaeger, Richard C. Blalock, Travis N.
Preferred Shelf Number 
TK7874 J33 2010
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Beytepe Library~1
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16. 
Cover image for Three-dimensional integrated circuit design
Three-dimensional integrated circuit design
Author 
Pavlidis, Vasilis F., 1976- Friedman, Eby G.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780123743435
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17. 
Cover image for Circuits at the nanoscale communications, imaging, and sensing
Circuits at the nanoscale communications, imaging, and sensing
Author 
Iniewski, Krzysztof.
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ONLINE
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18. 
Cover image for Nano-CMOS design for manufacturability robust circuit and physical design for sub-65 nm technology nodes
Nano-CMOS design for manufacturability robust circuit and physical design for sub-65 nm technology nodes
Author 
Wong, Ban P., 1953-
Preferred Shelf Number 
ONLINE
Electronic Access 
Click here to view book
Knovel http://app.knovel.com/web/toc.v/cid:kpNCMOSDM2
John Wiley http://dx.doi.org/10.1002/9780470382820
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=413074_0
http://site.ebrary.com/lib/alltitles/Doc?id=10278707
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19. 
Cover image for Measurement and modeling of silicon heterostructure devices
Measurement and modeling of silicon heterostructure devices
Author 
Cressler, John D.
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ONLINE
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20. 
Cover image for Handbook of 3D integration technology and applications of 3D integrated circuits
Handbook of 3D integration technology and applications of 3D integrated circuits
Author 
Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)
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ONLINE
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Connect to MyiLibrary resource.
John Wiley http://dx.doi.org/10.1002/9783527623051
ebrary http://site.ebrary.com/id/10577606
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21. 
Cover image for Microelectronic applications of chemical mechanical planarization
Microelectronic applications of chemical mechanical planarization
Author 
Li, Yuzhuo. Wiley InterScience (Online service)
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ONLINE
Electronic Access 
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0742/2007015557-b.html
John Wiley http://dx.doi.org/10.1002/9780470180907
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22. 
Cover image for Understanding fabless IC technology
Understanding fabless IC technology
Author 
Hurtarte, Jeorge S. Wolsheimer, Evert A. Tafoya, Lisa M.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780750679442
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23. 
Cover image for Fundamental principles of optical lithography the science of microfabrication
Fundamental principles of optical lithography the science of microfabrication
Author 
Mack, Chris A. Wiley InterScience (Online service)
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ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9780470723876
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24. 
Cover image for Fundamentals of semiconductor manufacturing and process control
Fundamentals of semiconductor manufacturing and process control
Author 
May, Gary S. Spanos, Costas J.
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ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5201952
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