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13. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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14. 
Cover image for Sensors for Environment, Health and Security Advanced Materials and Technologies
Sensors for Environment, Health and Security Advanced Materials and Technologies
Author 
Baraton, Marie-Isabelle. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9009-7
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15. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
Author 
Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-85695-7
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16. 
Cover image for Low Pressure Plasmas and Microstructuring Technology
Low Pressure Plasmas and Microstructuring Technology
Author 
Franz, Gerhard. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-85849-2
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17. 
Cover image for Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Author 
Fortin, Jeffrey. editor. Zribi, Anis. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138612
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18. 
Cover image for Nanoscale Phenomena Basic Science to Device Applications
Nanoscale Phenomena Basic Science to Device Applications
Author 
Tang, Zikang. editor. Sheng, Ping. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-73048-6
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19. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76534-1
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20. 
Cover image for Polymer Engineering Technologien und Praxis
Polymer Engineering Technologien und Praxis
Author 
Eyerer, Peter. author. Elsner, Peter. author. Hirth, Thomas. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-72419-3
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21. 
Cover image for Semiconductor Nanostructures
Semiconductor Nanostructures
Author 
Bimberg, Dieter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-77899-8
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22. 
Cover image for Nanotribology and Nanomechanics An Introduction
Nanotribology and Nanomechanics An Introduction
Author 
Bhushan, Bharat. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-77608-6
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23. 
Cover image for Laser Ablation and its Applications
Laser Ablation and its Applications
Author 
Phipps, Claude. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-30453-3
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24. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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