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13. 
Cover image for Tribology in chemical-mechanical planarization
Tribology in chemical-mechanical planarization
Author 
Liang, Hong. Craven, David.
Preferred Shelf Number 
TJ1075 .L53 2005
Format: 
Availability 
Beytepe Library~1
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14. 
Cover image for Tribology in chemical-mechanical planarization
Tribology in chemical-mechanical planarization
Author 
Liang, Hong, 1961- Craven, David R., 1945-
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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Availability 
Online Library~1
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15. 
Cover image for Tribology of abrasive machining processes
Tribology of abrasive machining processes
Author 
Marinescu, Ioan D.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815514909
Format: 
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Online Library~1
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16. 
Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Author 
Iyer, S. S., ed. Auberton-Herv�, A. J., e
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP001E
Format: 
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Online Library~1
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17. 
Cover image for Chemical mechanical planarization of microelectronic materials
Chemical mechanical planarization of microelectronic materials
Author 
Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html
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Online Library~1
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