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Microelectronic packaging.
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1. 
Cover image for Microelectronic applications of chemical mechanical planarization
Microelectronic applications of chemical mechanical planarization
Author 
Li, Yuzhuo. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0742/2007015557-b.html
John Wiley http://dx.doi.org/10.1002/9780470180907
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2. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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3. 
Cover image for Chemical mechanical planarization of microelectronic materials
Chemical mechanical planarization of microelectronic materials
Author 
Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html
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4. 
Cover image for Electron-beam technology in microelectronic fabrication
Electron-beam technology in microelectronic fabrication
Author 
Brewer, George Raymond, 1922- Ballantyne, J. P.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780121335502
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5. 
Cover image for Carbon-based nanocomposite applications and microelectronic technologies
Carbon-based nanocomposite applications and microelectronic technologies
Author 
Madkour, Loutfy H. (Loutfy Hamid), author.
Preferred Shelf Number 
TA418.9 .N35
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781032636092
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Cover image for Plasma electronics : applications in microelectronic device fabrication
Plasma electronics : applications in microelectronic device fabrication
Author 
Makabe, T. (Toshiaki), author. Petrovic, Z., author.
Preferred Shelf Number 
TA2020 .M35 2015
Electronic Access 
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7. 
Cover image for Plasma electronics : applications in microelectronic device fabrication
Plasma electronics : applications in microelectronic device fabrication
Author 
Makabe, T. (Toshiaki), author. Petrovic, Z.
Preferred Shelf Number 
TA2020 .M35 2006
Electronic Access 
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8. 
Cover image for Modeling of film deposition for microelectronic applications
Modeling of film deposition for microelectronic applications
Author 
Rossnagel, Stephen M.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780125330220
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9. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-658-41041-4
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10. 
Cover image for Microelectronic and signal processing : advanced concepts and applications
Microelectronic and signal processing : advanced concepts and applications
Author 
Goel, Sanket, editor.
Preferred Shelf Number 
TK5102.9 .M53 2021
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003168225
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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11. 
Cover image for Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Author 
Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)
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ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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12. 
Cover image for Handbook of lead-free solder technology for microelectronic assemblies
Handbook of lead-free solder technology for microelectronic assemblies
Author 
Puttlitz, Karl J. Stalter, Kathleen A.
Preferred Shelf Number 
TK7870.15 .H3657 2004
Electronic Access 
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