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13. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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14. 
Cover image for Nanoscale Photonics and Optoelectronics Science and Technology
Nanoscale Photonics and Optoelectronics Science and Technology
Author 
Wang, Zhiming M. editor. Neogi, Arup. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7587-4
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15. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-0040-1
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16. 
Cover image for Piezoelectric-Based Vibration Control From Macro to Micro/Nano Scale Systems
Piezoelectric-Based Vibration Control From Macro to Micro/Nano Scale Systems
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Jalili, Nader. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0070-8
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17. 
Cover image for Technology of Quantum Devices
Technology of Quantum Devices
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Razeghi, Manijeh. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1056-1
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18. 
Cover image for Electrochemical Nanotechnologies
Electrochemical Nanotechnologies
Author 
Osaka, Tetsuya. editor. Datta, Madhav. editor. Shacham-Diamand, Yosi. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1424-8
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19. 
Cover image for Embedded Memories for Nano-Scale VLSIs
Embedded Memories for Nano-Scale VLSIs
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Zhang, Kevin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88497-4
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20. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-92168-6
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21. 
Cover image for Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Author 
Fortin, Jeffrey. editor. Zribi, Anis. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138612
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22. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
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Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-78219-5
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23. 
Cover image for Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
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Huff, Howard R. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-74559-4
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24. 
Cover image for Copper Interconnect Technology
Copper Interconnect Technology
Author 
Gupta, Tapan. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0076-0
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