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13. 
Cover image for Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Use Cases and Emerging Challenges
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Use Cases and Emerging Challenges
Author 
Pasricha, Sudeep. editor. Shafique, Muhammad. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-40677-5
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14. 
Cover image for Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Software Optimizations and Hardware/Software Codesign
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Software Optimizations and Hardware/Software Codesign
Author 
Pasricha, Sudeep. editor. Shafique, Muhammad. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-39932-9
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15. 
Cover image for High-Performance Integrated Charge Pumps Design and Novel Solutions
High-Performance Integrated Charge Pumps Design and Novel Solutions
Author 
Ballo, Andrea. author. Grasso, Alfio Dario. author. Palumbo, Gaetano. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-43597-3
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16. 
Cover image for Security of FPGA-Accelerated Cloud Computing Environments
Security of FPGA-Accelerated Cloud Computing Environments
Author 
Szefer, Jakub. editor. (orcid)0000-0001-9721-3640 Tessier, Russell. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-45395-3
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17. 
Cover image for Artificial Intelligence and Sustainable Computing Proceedings of ICSISCET 2023
Artificial Intelligence and Sustainable Computing Proceedings of ICSISCET 2023
Author 
Pandit, Manjaree. editor. Gaur, M. K. editor. Kumar, Sandeep. editor. (orcid)0000-0003-4125-4165 SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-97-0327-2
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18. 
Cover image for Embedded Systems Design using the MSP430FR2355 LaunchPad™
Embedded Systems Design using the MSP430FR2355 LaunchPad™
Author 
LaMeres, Brock J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20888-1
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19. 
Cover image for HEMT Technology and Applications
HEMT Technology and Applications
Author 
Lenka, Trupti Ranjan. editor. Nguyen, Hieu Pham Trung. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2165-0
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20. 
Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
Author 
Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-93627-3
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21. 
Cover image for Artificial Intelligence and Hardware Accelerators
Artificial Intelligence and Hardware Accelerators
Author 
Mishra, Ashutosh. editor. Cha, Jaekwang. editor. Park, Hyunbin. editor. Kim, Shiho. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22170-5
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