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13. 
Cover image for Proceedings of the 7th International Conference on Kansei Engineering and Emotion Research 2018 KEER 2018, 19-22 March 2018, Kuching, Sarawak, Malaysia
Proceedings of the 7th International Conference on Kansei Engineering and Emotion Research 2018 KEER 2018, 19-22 March 2018, Kuching, Sarawak, Malaysia
Author 
Lokman, Anitawati Mohd. editor. Yamanaka, Toshimasa. editor. Lévy, Pierre. editor. Chen, Kuohsiang. editor. Koyama, Shinichi. editor.
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https://doi.org/10.1007/978-981-10-8612-0
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14. 
Cover image for Transdisciplinary Systems Engineering Exploiting Convergence in a Hyper-Connected World
Transdisciplinary Systems Engineering Exploiting Convergence in a Hyper-Connected World
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Madni, Azad M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-62184-5
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15. 
Cover image for Applied Physics, System Science and Computers Proceedings of the 1st International Conference on Applied Physics, System Science and Computers (APSAC2016), September 28-30, Dubrovnik, Croatia
Applied Physics, System Science and Computers Proceedings of the 1st International Conference on Applied Physics, System Science and Computers (APSAC2016), September 28-30, Dubrovnik, Croatia
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Ntalianis, Klimis. editor. Croitoru, Anca. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-53934-8
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16. 
Cover image for Advances in Computational Plasticity A Book in Honour of D. Roger J. Owen
Advances in Computational Plasticity A Book in Honour of D. Roger J. Owen
Author 
Oñate, Eugenio. editor. Peric, Djordje. editor. de Souza Neto, Eduardo. editor. Chiumenti, Michele. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-60885-3
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17. 
Cover image for Intelligent Manufacturing & Mechatronics Proceedings of Symposium, 29 January 2018, Pekan, Pahang, Malaysia
Intelligent Manufacturing & Mechatronics Proceedings of Symposium, 29 January 2018, Pekan, Pahang, Malaysia
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Hassan, Mohd Hasnun Arif. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8788-2
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18. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
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Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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19. 
Cover image for Introduction to Mechanical Engineering
Introduction to Mechanical Engineering
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Davim, J. Paulo. editor. (orcid)0000-0002-5659-3111 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-78488-5
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20. 
Cover image for Advances in Ergonomics in Design Proceedings of the AHFE 2017 International Conference on Ergonomics in Design, July 17−21, 2017, The Westin Bonaventure Hotel, Los Angeles, California, USA
Advances in Ergonomics in Design Proceedings of the AHFE 2017 International Conference on Ergonomics in Design, July 17−21, 2017, The Westin Bonaventure Hotel, Los Angeles, California, USA
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Rebelo, Francisco. editor. Soares, Marcelo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-60582-1
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21. 
Cover image for Proceedings of 3rd International Conference on the Industry 4.0 Model for Advanced Manufacturing AMP 2018
Proceedings of 3rd International Conference on the Industry 4.0 Model for Advanced Manufacturing AMP 2018
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Ni, Jun. editor. Majstorovic, Vidosav D. editor. Djurdjanovic, Dragan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-89563-5
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22. 
Cover image for Micro and Precision Manufacturing
Micro and Precision Manufacturing
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Gupta, Kapil. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-68801-5
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23. 
Cover image for Modeling, Analysis and Control of Hydraulic Actuator for Forging
Modeling, Analysis and Control of Hydraulic Actuator for Forging
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Lu, Xinjiang. author. Huang, Minghui. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-5583-6
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24. 
Cover image for Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
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Cheng, Jie. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-6165-3
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