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13. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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14. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
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ONLINE(331314.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3067-4
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15. 
Cover image for Sensors An Introductory Course
Sensors An Introductory Course
Author 
Kalantar-zadeh, Kourosh. author. SpringerLink (Online service)
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ONLINE(331661.1)
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http://dx.doi.org/10.1007/978-1-4614-5052-8
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16. 
Cover image for Fundamentals of Nanoscaled Field Effect Transistors
Fundamentals of Nanoscaled Field Effect Transistors
Author 
Chaudhry, Amit. author. SpringerLink (Online service)
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ONLINE(332128.1)
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http://dx.doi.org/10.1007/978-1-4614-6822-6
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17. 
Cover image for Piezoresistor Design and Applications
Piezoresistor Design and Applications
Author 
Doll, Joseph C. author. Pruitt, Beth L. author. SpringerLink (Online service)
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ONLINE(332425.1)
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http://dx.doi.org/10.1007/978-1-4614-8517-9
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18. 
Cover image for Introduction to Thin Film Transistors Physics and Technology of TFTs
Introduction to Thin Film Transistors Physics and Technology of TFTs
Author 
Brotherton, S.D. author. SpringerLink (Online service)
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ONLINE(332657.1)
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http://dx.doi.org/10.1007/978-3-319-00002-2
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19. 
Cover image for High Permittivity Gate Dielectric Materials
High Permittivity Gate Dielectric Materials
Author 
Kar, Samares. editor. SpringerLink (Online service)
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ONLINE(334228.1)
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http://dx.doi.org/10.1007/978-3-642-36535-5
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20. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4614-1812-2
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21. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0463-7
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22. 
Cover image for Semiconductor Modeling Techniques
Semiconductor Modeling Techniques
Author 
Balkan, Naci. editor. Xavier, Marie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27512-8
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23. 
Cover image for Piezotronics and Piezo-Phototronics
Piezotronics and Piezo-Phototronics
Author 
Wang, Zhong Lin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-34237-0
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24. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
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http://dx.doi.org/10.1007/978-1-4419-5760-3
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