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Shelf Location: Electronic Library

Author

Köhler, J. M. (J. Michael), 1956-

(2)

Wiley InterScience (Online service)

(2)

Arce, Gonzalo R.

(1)

(1)

(1)

Chen, Kuan-Neng.

(1)

D'Agostino, Riccardo.

(1)

Fang, Xiaosheng.

(1)

Flamm, Daniel L.

(1)

John Wiley & Sons.

(1)

Kan, Chi-wai, author.

(1)

Kaul, Anupama B.

(1)

Koester, Steven J.

(1)

Lichtenberg, Allan J.

(1)

Lieberman, M. A. (Michael A.)

(1)

(1)

Manos, Dennis M.

(1)

Perdigão, Jorge. editor.

(1)

Posseme, Nicolas, editor.

(1)

Powell, Ronald A.

(1)

(1)

Sangwal, Keshra.

(1)

Sankaran, Mohan.

(1)

SpringerLink (Online service)

(1)

Tan, Chuan Seng.

(1)

Tarn, William H.

(1)

Walker, Perrin.

(1)

(1)

Wüthrich, Rolf.

(1)

(1)

Zetterling, Carl-Mikael, ed.

(1)

Language

(20)

(1)

Publication Date

-

(4)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Plasma etching.

(8)

Nanostructured materials.

(4)

Diodes, Schottky-barrier.

(2)

Electronic apparatus and appliances.

(2)

Electronic books.

(2)

(2)

Masks (Electronics)

(2)

Microlithography.

(2)

Nanotechnology.

(2)

Ohmic contacts.

(2)

Plasma chemistry -- Industrial applications.

(2)

Plasma engineering.

(2)

Semiconductors--Junctions.

(2)

Semiconductors.

(2)

Bipolar transistors.

(1)

(1)

(1)

Crystal growth.

(1)

Crystals -- Etching.

(1)

(1)

(1)

Dyes and dyeing.

(1)

Electric discharges -- Industrial applications.

(1)

Electrochemical cutting.

(1)

(1)

Etching reagents -- Handbooks, manuals, etc.

(1)

Gallium arsenide.

(1)

Green chemistry.

(1)

Heterojunctions.

(1)

Integrated circuits -- Design and construction -- Mathematics.

(1)

Integrated circuits -- Very large scale integration -- Design and construction.

(1)

Integrated circuits -- Very large scale integration.

(1)

Ion implantation.

(1)

(1)

Laser ablation.

(1)

Metal insulator semiconductors.

(1)

Metal oxide semiconductors, Complementary.

(1)

Microelectronics.

(1)

Microlithography -- Mathematics.

(1)

Micromachining.

(1)

Micromechanics.

(1)

Nanoelectronics.

(1)

Nanostructures.

(1)

Optoelectronic devices.

(1)

(1)

Photolithography -- Mathematics.

(1)

Plasma dynamics.

(1)

Plasma polymerization.

(1)

(1)

(1)

(1)

(1)

Power semiconductors.

(1)

Resolution (Optics)

(1)

Semiconductors -- Etching -- Mathematics.

(1)

Semiconductors -- Etching.

(1)

Silicon compounds.

(1)

Surface preparation.

(1)

Textile chemistry.

(1)

Textile fibers -- Etching.

(1)

Thin films -- Surfaces.

(1)

Wide gap semiconductors.

(1)

(1)

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13.

Cover image for 3D integration for VLSI systems

3D integration for VLSI systems

3D integration for VLSI systems

Author

Tan, Chuan Seng. Chen, Kuan-Neng. Koester, Steven J.

Preferred Shelf Number

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Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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14.

Cover image for Handbook of innovative nanomaterials from syntheses to applications

Handbook of innovative nanomaterials from syntheses to applications

Handbook of innovative nanomaterials from syntheses to applications

Author

Fang, Xiaosheng. Wu, Limin.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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15.

Cover image for Computational lithography

Computational lithography

Computational lithography

Author

Ma, Xu, 1983- Arce, Gonzalo R. Wiley InterScience (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

Available by subscription from Safari Books Online
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=588875
John Wiley http://dx.doi.org/10.1002/9780470618943
Books24x7 http://www.books24x7.com/marc.asp?bookid=36422
Volltext http://proquest.tech.safaribooksonline.de/9781118043578

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16.

Cover image for Micromachining using electrochemical discharge phenomenon fundamentals and applications of spark assisted chemical engraving

Micromachining using electrochemical discharge phenomenon fundamentals and applications of spark assisted chemical engraving

Micromachining using electrochemical discharge phenomenon fundamentals and applications of spark assisted chemical engraving

Author

Wüthrich, Rolf.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815515876

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17.

Cover image for Principles of plasma discharges and materials processing

Principles of plasma discharges and materials processing

Principles of plasma discharges and materials processing

Author

Lieberman, M. A. (Michael A.) Lichtenberg, Allan J.

Preferred Shelf Number

ONLINE

Electronic Access

Full text available from Wiley InterScience
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=227410
John Wiley http://dx.doi.org/10.1002/0471724254
http://www3.interscience.wiley.com/cgi-bin/bookhome/109880578
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0618/2004058503-b.html

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18.

Cover image for Fabrication of GaAs Devices

Fabrication of GaAs Devices

Fabrication of GaAs Devices

Author

Baca, A. Ashby, C.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP006E

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19.

Cover image for Process Technology for Silicon Carbide Devices

Process Technology for Silicon Carbide Devices

Process Technology for Silicon Carbide Devices

Author

Zetterling, Carl-Mikael, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP002E

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20.

Cover image for Ätzverfahren für die Mikrotechnik

Ätzverfahren für die Mikrotechnik

Ätzverfahren für die Mikrotechnik

Author

Köhler, J. M. (J. Michael), 1956- John Wiley & Sons.

Preferred Shelf Number

ONLINE

Electronic Access

John Wiley http://dx.doi.org/10.1002/3527602917

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21.

Cover image for CRC handbook of metal etchants

CRC handbook of metal etchants

CRC handbook of metal etchants

Author

Walker, Perrin. Tarn, William H.

Preferred Shelf Number

ONLINE

Electronic Access

book distributed by CRC Press. Purchase or institutional license may be required for access.

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