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13. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J. W. author. SpringerLink (Online service)
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ONLINE(332682.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00122-7
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14. 
Cover image for Limits, Modeling and Design of High-Speed Permanent Magnet Machines
Limits, Modeling and Design of High-Speed Permanent Magnet Machines
Author 
Borisavljevic, Aleksandar. author. SpringerLink (Online service)
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ONLINE(333714.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-33457-3
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15. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4614-1053-9
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16. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J.W. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6348-2
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17. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84882-507-9
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18. 
Cover image for Design and Modeling of Millimeter-Wave CMOS Circuits for Wireless Transceivers Era of Sub-100nm Technology
Design and Modeling of Millimeter-Wave CMOS Circuits for Wireless Transceivers Era of Sub-100nm Technology
Author 
Lai, Ivan Chee-Hong. author. Fujishima, Minoru. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6999-4
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19. 
Cover image for Sensors Advancements in Modeling, Design Issues, Fabrication and Practical Applications
Sensors Advancements in Modeling, Design Issues, Fabrication and Practical Applications
Author 
Mukhopadhyay, S.C. editor. Huang, R.Y.M. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-540-69033-7
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20. 
Cover image for High-Level Modeling and Synthesis of Analog Integrated Systems
High-Level Modeling and Synthesis of Analog Integrated Systems
Author 
Martens, Ewout S. J. author. Gielen, Georges G. E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6802-7
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21. 
Cover image for Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrity
Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrity
Author 
Leventhal, Roy G. author. Green, Lynne. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b104647
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22. 
Cover image for TRANSISTOR LEVEL MODELING FOR ANALOG/RF IC DESIGN
TRANSISTOR LEVEL MODELING FOR ANALOG/RF IC DESIGN
Author 
GRABINSKI, WLADYSLAW. editor. NAUWELAERS, BART. editor. SCHREURS, DOMINIQUE. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4556-5
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23. 
Cover image for Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Author 
Kogel, Tim. author. Leupers, Rainer. author. Meyr, Heinrich. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4826-2
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24. 
Cover image for Transaction Level Modeling with SystemC TLM Concepts and Applications for Embedded Systems
Transaction Level Modeling with SystemC TLM Concepts and Applications for Embedded Systems
Author 
Ghenassia, Frank. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137175
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