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13. 
Cover image for Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Author 
Laconte, J. author. Flandre, D. author. Raskin, J. -P. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/0-387-28843-0
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14. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
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15. 
Cover image for Microscopy of Semiconducting Materials Proceedings of the 14th Conference, April 11–14, 2005, Oxford, UK
Microscopy of Semiconducting Materials Proceedings of the 14th Conference, April 11–14, 2005, Oxford, UK
Author 
Cullis, A. G. editor. Hutchison, J. L. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/3-540-31915-8
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16. 
Cover image for Thin Films and Heterostructures for Oxide Electronics
Thin Films and Heterostructures for Oxide Electronics
Author 
Ogale, Satischandra B. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b136780
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